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Skills Based Training

Workforce Development

ACI strives to ensure that every course conducted, regardless of content or training location, focuses on the successful performance of the skills and knowledge required in today’s working environment.

With technology increasing at an exponential rate, your company must stay current with technological advances in order to exist in the rapidly changing electronics industry.

Whether your company seeks to be more competitive through training in industry specifications, your own internal specifications, or by providing your employees with the proper engineering or skills-based training, ACI is prepared to meet the daily training challenges that your organization encounters.

Here is a sampling of the services ACI offers:

+ BGA Inspection, Rework and Repair

Location: Philadelphia, PA

Duration: One Day

Course Overview

Manufacturing with Ball Grid Array (BGA) packages generally offers high, first-pass process yields. However, process errors do occur and there is the likelihood of a solder joint defect (insufficient solder, bridging, solder balling, etc.) under the BGA that will require the removal and replacement of the BGA component. If BGA rework requires the removal of the component, special considerations must be taken into account. For instance, excessive heat or improper removal techniques has the potential to cause damage to surrounding lands, other components, or the PCB itself. Rework requires sound practices, proper tools and quality training.

Who Should Attend

This course is geared towards manufacturing, process and quality engineers responsible for implementing and/or controlling the BGA application and inspection process. Those personnel responsible for training operators and technicians to perform BGA assembly inspection or control the manufacturing process would also benefit from this course.

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+ Chip Scale Manufacturing

Location: Philadelphia, PA

Duration: Three Days

Course Overview

To meet the demand for smaller footprints, improved electrical performance and/or higher input/output in a given space, manufacturers are investigating advanced packaging technologies. This course will allow students to make informed decisions about advanced packaging technologies (flip chips, chip scale packages, wire bonding, micro BGAs and BGAs) based upon companies’ needs.

Who Should Attend

Engineering and manufacturing managers, process engineers, technicians, machine operators and trainers responsible for making next-generation manufacturing decisions in the company.

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+ Geometric Dimensioning and Tolerancing

Location: Philadelphia, PA

Duration: Three Days

Course Overview

Geometric Dimensioning and Tolerancing (GD&T) is a standardized symbolic language and design methodology used on engineering drawings and 3D models to ensure the product requirements are clearly understood by everyone using the information. GD&T are the tools by which we know a product will fit or align properly before it is manufactured. The use of and ability to understand GD&T is required by many large organizations and this requirement is passed onto the suppliers.

This course provides GD&T system concepts, rules, legal implications, tools and techniques from design, inspection, manufacturing, and concurrent engineering points of view. Learn functional dimensioning and tolerancing, explained in detail with many examples, all the symbology as well as the legal reasons for GD&T and its practical applications. Gain an understanding of how GD&T eliminates the deficiencies of plus and minus (+/-) dimensioning and tolerancing. This level 1 fundamental course is based on the ASME Y14.5-2009 Standard. Books are supplied and a calculator is recommended.

Who Should Attend

Anyone who deals with engineering drawings or annotated models is an ideal candidiate for this course. Engineering, design, inspection, quality assurance, quality control, manufacturing, assembly, service, purchasing, management, and other staff can also benefit from this material.

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+ Soldering Techniques for Electronic Assemblies

Location: Philadelphia, PA

Duration: One Day

Course Overview

The intent of this course is to provide the knowledge and hands-on training necessary to master the basic techniques of soldering for electronic assemblies. Individuals will learn the necessary skills to hand solder reliable electronic assemblies. This course combines classroom lecture with a practical lab to gain hands-on training in basic soldering techniques. An ACI Technologies Certificate will be awarded to all students at the end of the course.

Who Should Attend

This course is geared toward engineers, technicians, and electronic assemblers with limited hand soldering experience or those who want to improve their knowledge and raise their standard of skill.

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+ Lead Free Manufacturing Training

Location: Philadelphia, PA

Duration: Two Days

Course Overview

New lead free electronic manufacturing processes must be developed and implemented to eliminate lead from the electronics assembly process. Approved legislation, coupled with new commercial market pressure from Asia and Europe is forcing electronic manufacturers to consider new processes, materials and techniques to meet this challenge. ACI, a National Electronics Manufacturing Center of Excellence, has developed a comprehensive training program to provide lecture and hands-on factory experiences to support this endeavor. The course objective is to introduce participants to the technical challenges of developing and implementing lead free soldering into an electronic manufacturing production environment and provide application specific solutions to address each issue.

Who Should Attend

Everyone responsible for the development and implementation of lead free solder into their manufacturing production and rework/repair processes.

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+ Fundamentals of Selective Soldering

Location: Philadelphia, PA

Duration: One Day

Course Overview

This one-day course combines lecture and hands-on demonstration of the principles and techniques utilized
in this through-hole process of modern electronics manufacturing. It is an amalgamation of theoretical principles
with hands-on application of those principles to provide a comprehensive understanding of the benefits of selective
soldering within modern electronics manufacturing.

Who Should Attend

Engineers, technicians, group leaders or supervisors who need to familiarize themselves with the various processes, equipment, and materials used in this through-hole process are good candidates for this course.

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+ Profiling and Solder Reflow

Location: Philadelphia, PA

Duration: Two Days

Course Overview

ACI Technologies offers multiple training courses about the business of electronics assembly;
this course is intended to provide personnel with the knowledge and skills necessary to set up
and operate a reflow process. Upon completion of this class, students will be able to apply
their knowledge of reflow soldering techniques by successfully identifying the heat transfer
modes and systems for each reflow method covered.

Who Should Attend

Engineers, technicians, quality assurance personnel and managers can familiarize themselves with the various processes, equipment, analytical tools/materials used in establishing and refining an effective time-temperature profile. This course is ideal for senior technicians, engineers, and supervisors/group leaders desiring to increase their knowledge of electronics manufacturing through both classroom discussion and hands-on experience.

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Do you need quick answers to your electronics manufacturing questions?