Publications

TECHtips are a series of free articles provided to our customers to inform them of the latest methods and techniques employed by the electronics experts at ACI. These articles are technical and informative and make great reference documents. They provide recommendations, explanations of requirements or step-by-step illustrations of a process.

TECHtips - Counterfeit Component Analysis

Counterfeit Component Analysis

January, 2020

TECHtips - Mechanical Drop Shock Testing

Mechanical Drop Shock Testing

February, 2020

TECHtips - Cleaning No-Clean Fluxes Prior to Conformal Coating

Cleaning No-Clean Fluxes Prior to Conformal Coating

March, 2020

TECHtips - Product Design and Early Manufacturing Involvement

Product Design and Early Manufacturing Involvement

April, 2020

TECHtips - Pad Cratering

Pad Cratering

May, 2020

TECHtips - Lead-Free Control Plan

Lead-Free Control Plan

June, 2020

TECHtips - Lead-Free Risk Mitigation - A Case Study

Lead-Free Risk Mitigation — A Case Study

July, 2020

TECHtips - ALD of Alumina Ceramic Films for Hermetic Protection

ALD of Alumina Ceramic Films for Hermetic Protection

August, 2020

TECHtips - Reworking ALD Coatings

Reworking ALD Coatings

September, 2020

TECHtips - Ball Grid Array (BGA) Voiding Affecting Functionality

Ball Grid Array (BGA) Voiding Affecting Functionality

October, 2020

TECHtips - A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested

A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested

November, 2020

TECHtips - Tin Whisker Risk Assessment Improves Reliability

Tin Whisker Risk Assessment Improves Reliability

December, 2020

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