The manufacturing factory at ACI includes a clean room, power electronics assembly and packaging laboratory.
This specialized facility aids in the development of manufacturing and assembly technologies that can exploit the advantages of advanced materials.
The lab contains equipment that enables flip chip assembly, hybrid bonding, wirebonding, and hermetic packaging of electronics devices, and surface mount chips and components. Additional equipment and capabilities support thermal analysis and electrical characterization testing at the wafer and device level.
Benefits include developing capabilities and solutions for the following:
- Electronic packaging for high power semiconductors
- High temperature wire bonding materials and techniques
- High temperature die attach materials and techniques
- Near-hermetic high temperature housing materials, die coatings, and encapsulates
- Simulations and models for mechanical, electrical, RF, thermal, and thermo-fluid designs
- Shorter R&D cycles for RF devices, systems in a package, and power semiconductor packages and materials
- Packaging solutions using high thermal conductivity materials, such as adhesives, thermal paste, thermal heat spreaders, heat sinks, and die attach solders for junction temperatures greater than 200ºC
- More affordable commercial packaging solutions for up to 200ºC operation, high current density packages and modules, high frequency packages and modules, and high voltage packages and modules
The power electronics assembly and packaging laboratory employs analytical techniques, such as acoustic microscopy, fluorescence illumination, field emission scanning electron microscopy, and liquid crystal analysis. These analyses assist in evaluating advanced substrates, die attach materials and wire bond materials technologies.