Home » Analytical Services » Failure Analysis

Failure Analysis

X-Ray image of through holes of a PCB

Failure analysis is a common term that is used in the electronics industry for the process of investigating variables that may have resulted in a defect or interruption in function.

We can perform the investigation and supply a resolution to prevent future failures or defects.

Failure can be observed at any step in the process, from manufacturing to a field return. If you have encountered a problem in your process, members of our team will meet with you prior to the analysis to investigate the best route of identifying the root cause.

A multitude of instrumentation can be used to assist with each analysis. A list of our instrumentation can be found in our Capabilites Guide.

Do you need quick answers to your electronics manufacturing questions?