Capabilities Guide
Services Offered
ACI delivers precise analysis by utilizing a wide range of analytical techniques and its professionals in respective fields such as engineering, physics, and chemistry.
All of the technical personnel at ACI have a minimum bachelors degree that is relevant to electronics and the electronics industry. These factors set ACI apart from other analytical service providers.
Below is a list of equipment and capabilities offered by ACI:
+ Advanced Analytical Techniques
- Decapsulation
- Delidding
- Differential Scanning Calorimetry (DSC)
- Electrostatic Discharge (ESD) / Electrical Overstress (EOS) Analysis
- Energy Dispersive X-Ray Spectroscopy (EDS)
- Field Emission – Scanning Electron Microscopy (FE-SEM)
- Fourier Transform Infrared (FTIR) Spectroscopy
- Ion Chromatography (IC)
- Scanning Electron Microscopy (SEM)
- Sequential Electrochemical Reduction Analysis (SERA)
- Thermogravimetric Analysis (TGA)
- Ultraviolet/Visible/Near-Infrared (UV/Vis/NIR) Spectroscopy
- Wetting Balance Testing
- X-ray Fluorescence (XRF) Spectroscopy
+ Chemical Testing
- Cleanliness Testing
- Composition
- Corrosion Product Analysis
- Electroconductivity (EC)
- Elemental Analysis
- Inorganic Identification
- Organic Identification
- pH
- Residue Analysis
- Resistivity of Solvent Extract (ROSE)
- Solder Analysis
- Solderability Testing
- Surface Finish Analysis
- Total Dissolved Solids (TDS)
- Transition Temperatures (Melting Point, Glass Transition, etc.)
+ Electrical Testing
- Capacitance of Devices
- Continuity
- Inductance of Devices
- Q Factor
- Resistance
- Ask us about Automatic Electrical Testing, Data Acquisition, and Power and Current Cycling
+ Environmental Testing
- Accelerated Aging
- Electromigration
- Environmental Stress Screening (ESS)
- Highly Accelerated Stress Testing (HAST)
- Mechanical Drop Shock Testing
- Salt Fog Chamber Testing
- Steam Aging
- Surface Insulation Resistance (SIR)
- Thermal Cycling
- Thermal Shock
- Thermal Stress
- Temperature/Humidity Testing
- Vibration/Mechanical Testing
+ Mechanical Testing
- Adhesion
- Coating Thickness
- Cross-Sectional Analysis
- Die Shear / Wire Bond Testing
- Dimensional Analysis
- Dye and Pry Testing
- Microsectioning
- Non-Destructive Wire Bond Pull Testing
- Plating Thickness
- Solder Mask Adhesion – Tape Test Method
- Wire Bond Pull Testing
+ Testing Programs
- Assembly Process Validation
- Component Authenticity Verification
- Consultation
- Contamination Analysis
- Counterfeit Component Analysis
- Failure Analysis
- First Article Inspection
- IPC Products and Training
- Lead-Free Quality and Reliability Testing
- Printed Circuit Board Analysis
- Qualification, Acceptance, and Conformance Testing
- Reliability Testing
- Supplier Surveillance Testing