Qualification of Bare Boards
Services Offered
Qualification of boards and assemblies is the comparison of the board or assembly to an industry standard.
Specifically, we qualify printed circuit boards to IPC-6012 – Qualification and Performance Specifications for Rigid Printed Boards and IPC-A-600 – Acceptability of Printed Circuit Boards, to classes 1, 2, and 3. ACI has the capability to perform PCB qualification including Single Sided Testing, Multilayer, and Double sided testing.
In addition to the previously stated qualifications, we can also perform:
- Visual examination using optical microscopy to study the surface features and finishes
- X-ray fluorescence (XRF) spectroscopy for thickness measurements of surface finishes
- Micro-sectioning the board and evaluating the internal construction, and Scanning
- Electron microscopy with energy dispersive X-ray spectroscopy (SEM-EDS) to examine the elemental composition of features along with high magnification imaging
PCB Qualification includes:
+ Multi Layer and Double Sided Testing
- Visual Inspection – IPC 600 Rev G (Class 2) and IPC 6012 Section 3.3 Visual Examination
- Thermal Stress as per IPC TM-650 2.6.8
- Ionic Cleanliness Testing as per IPC TM-650 2.3.25.1 (Dynamic ROSE Test (Ionograph))
- Hole Size Measurement as per IPC TM-650 2.2.6 & 2.2.7
- Bow & Twist Evaluation as per IPC TM-650 2.4.22
- Adhesion/Tape Test as per IPC TM-650 2.4.1
- Rework Simulation/ Unsupported Holes as per IPC TM-650 2.4.3
- Dimensional Inspection w/Micro section as per IPC-TM-650 2.2.5
- PWB Solderability Assessment as per J-STD-003 4.2.3 Test C (tin-lead) or Test C1 (lead free) after steam aging for 8 hrs
+ Single Sided Testing
- Visual Inspection – IPC 600 Rev G (Class 2) and IPC 6012 Section 3.3 Visual Examination
- Ionic Cleanliness Testing as per IPC TM-650 2.3.25.1 (Dynamic ROSE Test (Ionograph))
- Hole Size Measurement as per IPC TM-650 2.2.6 & 2.2.7
- Bow & Twist Evaluation as per IPC TM-650 2.4.22
- Adhesion/Tape Test as per IPC TM-650 2.4.1
- Land Bond Strength, Unsupported holes as per IPC TM-650 2.4.21
- PWB Solderability Assessment as per J-STD-003 4.2.3 Test C (tin-lead) or Test C1 (lead free) after steam aging for 8 hrs
We have staff members that are master and certified instructors for IPC A 600.