Solderability Analysis and Restoration

ACI provides wetting and solderability evaluations that determine if components or boards will solder acceptably before costly rework and repair is required. ACI can also investigate the root cause of many solderability problems including oxide formation, a leading cause of reduced solderability.

Components and PWBs that exhibit poor solderability decrease product yield. Even the slightest reduction in solderability can lead to:

• Tombstoning
• Voiding
• Poor wetting
• Weak joints
• Increased rework

Solderability restoration is available for components and boards that have solderability problems related to oxide and sulfide formation.

Solderability Analysis and Restoration Services

1. Measure component and PWB solderability

ACI performs quantitative wetting balance solderability testing as well as qualitative dip-and-look tests. The tests can be performed on leaded components, chip components, wires, and coupons, with the results compared to established evaluation standards such as the J-STD 002 and 003, as well as IEC-68-2-69 among others.

2. Evaluate surface oxide thickness, sulfide thickness, and gold porosity

Sequential Electrochemical Reduction Analysis (SERA) provides thickness measurements for flat smooth tin, silver, tin/lead, and gold surfaces.

3. Restore component and pad solderability

ACI uses Reduced Oxide Solderability Activation (ROSA) to remove metal oxides and sulfides that inhibit solderability. It can be performed on tin oxides, copper oxides, silver oxides, and silver sulfides. This technique is excellent for components and boards that had not been stored properly and exhibit poor solderability.

If you have any questions about the services listed here, or would like to request a quote for any service, please call the Helpline at (610) 362-1320, or click here to submit you question via our Helpline Form